Copper Foil 1125

Copper Foil 1125

For EMI shielding on a wide range of electronic applications. Easily die cut.

Specification

Product Material: 1.4-mil copper foil


Adhesive: Acrylic nonconductive

For EMI shielding, static charge draining when grounded. Easily die cut.

For EMI shielding, static charge draining when grounded. Easily die cut.

For EMI shielding, static charge draining when grounded. Easily die cut.

Specification

Product Material: 1.4 mil copper foil


Adhesive: Acrylic conductive

Copper Foil 1181

Copper Foil 1181

For EMI shielding, static charge draining, grounding. Easily die cut.

Specification

Product Material: 1.4 mil copper foil


Adhesive: Acrylic conductive

Copper Foil 1182

Copper Foil 1182

Typically used to bond two surfaces, both physically and electrically. Also provides EMI shielding, static charge draining, grounding.

Specification

Product Material: 1.4-mil copper foil


Adhesive: Acrylic conductive coated on both sides

Copper Foil 1183

Copper Foil 1183

Oxidation resistant for long-term EMI shielding, static charge draining, grounding. Solderable &easily die cut.

Specification

Product Material: 1.4-mil tin-plated copper foil


Adhesive: Acrylic conductive

Copper Foil 1194

Copper Foil 1194

For EMI shielding, static charge draining, grounding. Easily die cut.

Specification

Product Material: 1.4 mil copper foil


Adhesive: Acrylic nonconductive

Copper Foil CU-35C

Copper Foil CU-35C

For grounding and EMI shielding. Solderable and easily die cut.

Specification

Product Material: 1.4 mil copper foil


Adhesive: Acrylic conductive

Embossed Foil 1345

Embossed Foil 1345

Oxidation resistant for long-term EMI shielding, static charge draining, grounding. Solderable, easily die cut.

Specification

Product Material: Embossed tin-plated copper foil


Adhesive: Acrylic nonconductive